Whether or not you want mechanical sawing, Ion implantation, or die singulation, we have now you lined. Our crew will get your undertaking achieved proper – quick. Beneath is a short overview of those wafer dicing companies. We additionally provide different companies, reminiscent of wafer reducing and die singulation.
Ion implantation
Built-in system producers want the very best ion implantation companies to enhance the efficiency of their wafer dicing gear and to reduce the price of possession. II-VI affords refurbishment companies for each disks and warmth sinks. Refurbishment companies embrace qualification, set up, course of testing, scheduled and unscheduled upkeep, and end-of-life willpower. A wide range of ion implanter fashions are supported.
The ion beam could be implanted into targets for the aim of making a brand new crystallographic part beneath the host crystal. It may also be implanted on the floor of a substrate, which produces a layer with a crystallographically matching part. This course of may also lead to alloying the floor, making it corrosion-resistant, or strengthening adhesion between layers.
Laser ablation
The price of laser ablation for wafer dicing is a big consideration when deciding which dicing course of to make use of. The associated fee per die is determined by the variety of die required, the time it takes to cube the wafer, and the yield of the system. Probably the most cost-effective answer is blade dicing, which has been round for many years. Spare elements and used methods are available. The subsequent greatest choices are laser ablation and Stealth Dicing(r) processes. Nevertheless, the price of plasma options requires the best preliminary capital expenditure, significantly if you’re planning a large-volume program.
Though laser ablation has many advantages, one of many largest challenges is the removing of fabric from the kerf. When dicing a wafer, a 20um kerf is roughly equal to the hole between two three-story buildings. That’s nearly as large a spot as one can throw a ball via! Nevertheless, some lasers can take away materials from the kerf with out inflicting harm to the underlying layers.
Stealth dicing
One of the necessary elements of stealth dicing is the power to keep away from the impression of a shock on the energetic floor. The shock is diverted below the floor, the place it’s absorbed by a line of pulses that create a crack aircraft resulting in die separation. The nearer the road is to the energetic floor, the much less impulse vitality is used, whereas the additional it’s beneath the floor, the much less vitality is required. As well as, the stealth dicing course of produces nearly no warmth and no particles.
One other function of stealth dicing is the elimination of waste from the method. It’s a zero-waste course of, and in contrast to laser ablation, there isn’t any want to wash and sterilize the dies. It may be utilized to many various supplies, together with multi-project-wafers, MEMS, and varied supplies. Stealth dicing is a two-stage course of that produces very small perforations within the SD layer.
Tape dicing
Tape dicing companies for wafer manufacture can be found in varied varieties to satisfy the wants of consumers. These companies embrace guide dicing, automated die sorting, and tape dicing. They’ll additionally cube waffles, gel packages, and particular person dies. As well as, these companies may also cube bumped wafers or parts of them. Many of those companies additionally enable for high-temperature dicing of varied supplies.
There are two sorts of tape dicing companies out there: UV Dicing tape and non-UV tape. Each have completely different properties. The previous affords the next adhesion energy, whereas the latter could be simply eliminated. The non-UV tape’s backing is manufactured from non-halogen supplies and is expandable. Each sorts of tape dicing can be found for a variety of purposes, together with ICs, LTCC substrates, Si wafers, glass, ceramics, and extra.
Conventional blade dicing
Dicing processes are designed to create nearly excellent edges, and are particularly useful when a cloth is extraordinarily arduous and brittle. These processes enable greater reducing speeds whereas sustaining the self-sharpening mechanism of dicing blades. Whereas the dicing course of might produce barely inferior edges, this course of is essentially the most cost-effective solution to course of skinny wafers. This text will focus on a few of the advantages of blade dicing for wafers.
Dicing blades are made for reducing all kinds of supplies, together with glass on silicon. Chances are you’ll wish to seek the advice of with the producer of your dicing machine to search out out what sorts of blades can be found for different reducing purposes. Dicing blade thickness will rely upon the fabric being reduce and the publicity of the blade. For instance, skinny glass might require a skinny blade with a high-speed spindle.
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